摘要
The dynamic recrystallization behavior of 7085 aluminum alloy during hot compression at various temperatures (573-723 K) and strain rates (0.01-10 s(-1)) was studied by electron back scattered diffraction (EBSD), electro-probe microanalyzer (EPMA) and transmission electron microscopy (TEM). It is shown that dynamic recovery is the dominant softening mechanism at high Zener-Hollomon (Z) values, and dynamic recrystallization tends to appear at low Z values. Hot compression with ln Z=24.01 (723 K, 0.01 s(-1)) gives rise to the highest fraction of recrystallization of 10.2%. EBSD results show that the recrystallized grains are present near the original grain boundaries and exhibit similar orientation to the deformed grain. Strain-induced boundary migration is likely the mechanism for dynamic recrystallization. The low density of Al3Zr dispersoids near grain boundaries can make contribution to strain-induced boundary migration.