Active cycling reliability of power devices: Expectations and limitations

作者:Kanert W*
来源:Microelectronics Reliability, 2012, 52(9-10): 2336-2341.
DOI:10.1016/j.microrel.2012.06.031

摘要

Active cycling of power devices, i.e. exposure to repetitive voltage and current pulses, causes power dissipation, resulting in thermo-mechanical loads that can cause different failure mechanisms. This paper focuses on degradation of the metallization. Requirements and customer expectations, using examples from automotive applications, are discussed, contrasting these with the procedures for reliability assessment and their limitations.

  • 出版日期2012-10