Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints

作者：Yin L M^*; Zhang X P; Lu Chunsheng

来源：Journal of Electronic Materials, 2009, 38(10): 2179-2183.

DOI：10.1007/s11664-009-0858-4

• Lead-free solder
• volume effect
• strength
• mechanical constraint
• intermetallic compounds

The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume (V = (pi)/(4)d(2)t) and the correlation follows an inverse proportional function reasonably well.

• 出版日期2009-10
• 单位华南理工大学