A study on the diamond grinding of ultra-thin silicon wafers

作者：Zhou L^*; Tian Y B; Huang H; Sato H; Shimizu J

来源：Proceedings of the Institution of Mechanical Engineers - Part B: Journal of Engineering Manufacture , 2012, 226(B1): 66-75.

DOI：10.1177/0954405411414768

• silicon wafer
• Thinning process
• grain depth of cut
• subsurface damage
• minimum wafer thickness

The demand for ultra-thin silicon wafers has escalated in recent years with the rapid development of miniaturized electronic devices. In this work, diamond grinding for thinning silicon wafers was carried out on an ultra-precision grinding machine. The thinning performance and the minimum wafer thickness were investigated under different grinding conditions. It was found that the grain depth of cut that was used to characterize the overall grinding conditions played an important role in the determination of the final grinding performance. The relationship between the subsurface damage of the ground wafer and the minimum wafer thickness achieved was also revealed.

• 出版日期2012-1