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摘要
Thin nanocrystalline, compact films, based on the copper-nitrogen system, up to 2.5 mu m thickness and 3.5% nitrogen, were deposited by magnetron sputtering at different partial pressure ratios of N(2) and Ar, without formation of Cu(x)N compounds, the nitrogen concentration influencing grain size (down to 30 nm) and film homogeneity. Electrochemical corrosion properties were investigated using polarization curves and electrochemical impedance spectroscopy in 0.5 M NaCl aqueous solution, and compared with pure bulk copper: morphology was examined by scanning electron microscopy. Significant variations in corrosion currents between samples were attributed to grain size and structural defects on the grain boundaries.
- 出版日期2010-12
