科研之友
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摘要
The coupled grain boundary migration driven by shear stress is considered to be an important factor in grain growth. We carried out a molecular dynamic simulation to investigate the critical stress of this motion in a grain boundary of tungsten. It is revealed that the dependence of critical stress on temperature follows a sigmoidal-like curve at a temperature range from 10 to 1200 K. A high temperature is associated with a small critical stress. The shear strain, however, exhibits an independence of critical stress under the shear rate from 0.1 to 10 m/s(-1)
- 出版日期2014-7
- 单位北京航空航天大学
