Development of high strength, high conductivity copper by friction stir processing

作者：Surekha K^*; Els Botes A

来源：Materials & Design, 2011, 32(2): 911-916.

DOI：10.1016/j.matdes.2010.08.028

The objective of this study is to obtain a high strength, high conductivity copper by friction stir processing. Three milli meter thick pure copper plate was friction stir processed to a depth of 2.8 mm at low-heat input conditions by varying the travel speed from 50 to 250 mm/min at a constant rotation speed (300 rpm) to obtain fine grains. Grain size of the nugget decreased from 9 to 3 mu m and the hardness increased from 102 to 114 H(v) by increasing the traverse speed from 50 to 250 mm/min. Yield strength, microhardness and ultimate tensile strength increased with decrease in grain size in the nugget region and the yield strength obeyed as sigma(s) = 223.8 + 0.07d(-1/2) Hall-Petch relationship, where d is the grain size in m. Electrical resistivity measurement at room temperature showed that there was no change in the resistivity of the processed samples compared to the base metal.

• 出版日期2011-2