Antibacterial and tribological properties of TaN-Cu, TaN-Ag, and TaN-(Ag,Cu) nanocomposite thin films

作者:Hsieh J H*; Yeh T H; Hung S Y; Chang S Y; Wu W; Li C
来源:Materials Research Bulletin, 2012, 47(10): 2999-3003.
DOI:10.1016/j.materresbull.2012.04.101

摘要

In this study, attempts were made to prepare and characterize TaN-(Cu,Ag) nanocomposite films by using a hybrid approach combining reactive co-sputtering and rapid thermal annealing at various temperatures to induce the formation of soft metal particles in the matrix or on the surface. The films%26apos; properties and their antiwear and antibacteria behaviors were compared with those previously studied TaN-Cu and TaN-Ag films. All three types of TaN-(soft metal) films showed good tribological properties due to the lubricious Ag and/or Cu layers. It was also found that the antibacteria efficiency of TaN-(Ag,Cu) film against either Escherichia coli or Staphylococcus aureus could be much improved, comparing with that of TaN-Ag or TaN-Cu film. The synergistic effect due to the coexistence of Ag and Cu is obvious. The annealing temperature used to develop TaN-(Cu,Ag) films with good antibacterial and antiwear behaviors could be as low as 250 degrees C. The lowering of the annealing temperature made these films applicable onto low-melting-point materials, such as polymers.