Model analysis and experimental investigation of the friction torque during the CMP process

作者：Guo Dongming^*; Xu Chi; Kang Renke; Jin Zhuji

来源：Chinese Journal of Semiconductors, 2011, 32(3): 036002.

DOI：10.1088/1674-4926/32/3/036002

• Chemical-mechanical polishing process
• CMP
• CMP process
• Detection experiments
• End-point detection methods
• endpoint detection
• Experimental investigations
• Friction force
• friction torque
• Model analysis
• Polishing head
• Research results
• Theoretical foundations

A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented, and the friction force and torque detection experiments during the CMP process are carried out to verify the model. The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.

• 出版日期2011