A High-Linearity X-Band Four-Element Phased-Array Receiver: CMOS Chip and Packaging

作者：Shin Donghyup^*; Rebeiz Gabriel M

来源：IEEE Transactions on Microwave Theory and Techniques, 2011, 59(8): 2064-2072.

DOI：10.1109/TMTT.2011.2156424

• Active circuits
• analog circuits
• CMOS integrated circuits
• integrated circuit packaging
• phased arrays
• phase shifters
• printed circuits
• radar
• receivers
• wireless communication

This paper presents the design and chip-on-board packaging of a high-linearity four-element phased-array receiver for 9-10-GHz applications. The phased-array is built using 0.13-mu mCMOS with a single-ended design, and it results in a measured gain of 10.1 dB, an input P(1dB) of -12.5 dBm, an input IP(3) of -4 dBm, and a noise figure of 3.4 dB at 9.5 GHz. An rms gain error of <0.4 dB and phase error of <8 degrees are obtained at 9-10 GHz using an integrated variable gain amplifier and an 11 phase trim bit. The chip occupies an area of 2.5 x 2.9 mm(2) with a power consumption of 36 mW per channel from a 1.8-V supply (144-mW total). The phased array is packaged using chip-on-board techniques and the channel-to-channel coupling is determined either by the chip-to-ground inductance or by coupling between the input bond-wires. Measurements and simulations on channel 1 show that, with well isolated input bond-wires, one can obtain < -31-dB coupling between the channels, and an rms amplitude and phase error of similar to 0.2 dB and similar to 1 degrees, respectively, at 9.5 GHz, when the phase of channels 2-4 are changed. To our knowledge, this is the first in-depth study of coupling in a phased-array chip with packaging considerations.

• 出版日期2011-8