Application of I-structure though-glass interconnect filled with submicron gold particles to a hermetic sealing device

作者：Nomura Kazuya^*; Okada Akiko; Shoji Shuichi; Ogashiwa Toshinori; Mizuno Jun

来源：Journal of Micromechanics and Microengineering, 2016, 26(10): 105018.

DOI：10.1088/0960-1317/26/10/105018

• hermetic sealing
• glass-to-glass structure
• VUV/O-3 treatment
• low-temperature bonding
• gold particles
• 3D integration
• daisy chain

We propose hermetic sealing of a glass-to-glass structure with an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. The top and bottom bumps and the TGV were formed by a simple filling process with a bump-patterned dry film resist. The sealing devices consisting of two glass substrates were bonded via Au interlayers. Vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O-3) pretreatment was used for low-temperature Au-Au bonding at 200 degrees C. The bonded samples showed He leakage rates of less than 1.3 x 10(-9) Pa m(3) s(-1). The cross-sectional scanning electron microscope images of the fabricated I-structure TGV showed perfect adhesion between the I-structure TGV and glass substrate. These results indicate that the proposed I-structure TGV is suitable for hermetic sealing devices.

• 出版日期2016-10