Advantages of utilizing through-silicon-vias in SiGe HBT RF low-noise amplifier design

作者：Song Ickhyun^*; Cho Moon Kyu; Jung Seungwoo; Ju Inchan; Cressler John D

来源：Microwave and Optical Technology Letters, 2015, 57(11): 2703-2706.

DOI：10.1002/mop.29412

• through-silicon-via
• low-noise amplifier
• SiGe HBT
• wire bonding
• inductive degeneration

The benefits of using through-silicon-vias (TSVs) in silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) low-noise amplifiers (LNAs) over the conventional wire bonding have been investigated for the first time. The parasitics associated with wire bonding can be significantly minimized with TSVs, thereby reducing the LNA performance degradation at the packaging level. To verify simulations and theoretical analysis, a prototype K-band TSV-integrated LNA was implemented in a SiGe HBT platform. The parasitic inductance of TSVs was effectively utilized as an adjustable matching element for the optimum LNA performance. The proposed LNA exhibits minimal degradation compared to the (unpackaged) LNA with probe-supplied ground.

• 出版日期2015-11