Delamination behavior and formation mechanism of the interfacial microstructure in the brazed joint of silver-copper-titanium alloy and cubic boron nitride grain

作者：Ding Wenfeng^*; Xu Jiuhua; Fu Yucan; Su Honghua; Xiao Bing; Xu Hongjun

来源：Chinese Journal of Mechanical Engineering, 2008, 44(6): 61-65.

• Abrasive grains
• Brazed joints
• Cubic boron nitride (c BN)
• Dwell time
• Energy dispersions
• Formation mechanisms
• Heating temperatures
• Interfacial layer (IFO)
• Interfacial microstructures
• Interfacial regions
• Scanning electron microscope (SEM)
• Transitional layers
• X ray diffraction (XRD)

The joining experiments are carried out with heating temperature 920°C for dwell time 5 min on cubic boron nitride (CBN) abrasive grains and 0.45%C steel by using silver-copper-titanium (AgCuTi) alloy as brazing filler. The interfacial microstructure and newly-formed phases are detected with scanning electron microscope (SEM), energy dispersion spectrometer (EDS) and X-ray diffraction (XRD). The results show that the delamination phenomenon in the interfacial layer takes place during brazing. From CBN grain to the filler, the interfacial region is composed of a transitional layer, i.e. CBN/TiB2/TiB/TiN/Ti contained allay, which has the remarkable advantage in improving the performance of the brazed joint. The interfacial compounds could be formed in virtue of the displacement reaction according to the thermodynamic analysis. Meanwhile, the formation sequence of the reaction products (TiN, TiB2, TiB) is determined by the difference in the diffusion behavior of B and N atoms.

• 出版日期2008
• 单位南京航空航天大学