Development of lead-free wave soldering process

作者：Arra M^*; Shangguan D; Yi S; Thalhammer R; Fockenberger H

来源：IEEE Transactions on Electronics Packaging Manufacturing, 2002, 25(4): 289-299.

DOI：10.1109/TEPM.2002.807731

• lead-free soldering
• Sn/Ag/Cu
• soldering process
• wave soldering

Lead-free wave soldering was studied in this work using 95,5Sn/3,8Ag/0,7Cu alloy. A process DOE was developed, with three variables (solder bath temperature, conveyor speed, and soldering atmosphere), using a dual wave system. Four no-clean flux systems, including alcohol- and water-based types, were included in the evaluation. A specially designed "Lead-Free Solder Test Vehicle", which has various types of components, was used in the experiments. Both organic solderability preservative (OSP) and electroless nickel/ immersion gold (Ni/Au, or ENIG) surface finishes were studied. Soldering performance (bridging, wetting and hole filling) was used as the responses for the DOE. In addition, dross formation was measured at different solder bath temperatures and atmospheres. Dross formation with Sn/Ag/Cu bath was compared to that with eutectic Sn/Pb bath. Regarding the connector-type component, a pad design giving the best soldering performance was evaluated based on the DOE results. Finally, a confirmation run with the optimum flux and process parameters was carried out using the Sn/Ag/Cu solder, and a comparative run was made with the Sn/Pb solder alloy and a no-clean flux used in production. The soldering results between the two runs indicate that with optimum flux and process parameters, it is possible to achieve acceptable process performance with the Sn/Ag/Cu alloy. Pull testing and cross-section study were used to verify the solder joint integrity and the mechanical performance of Sn/Ag/Cu solder in comparison with Sn/Cu and Sn/Pb solders joints.

• 出版日期2002-10