About the measurement of dynamic mechanical properties of bi-layer systems

作者：Goyanes SN^*; Roncaglia A; Saavedra F; Rubiolo GH

来源：Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 2004, 370(1-2): 431-434.

DOI：10.1016/j.msea.2003.07.022

• dynamic mechanical analyzer
• three points bending test
• polymer-hard substrate bi-layer systems
• loss tangent
• complex bending stiffness

The bi-layer system has been well developed for many engineering structural components in the aircraft, automotive, microelectronics and modem space industries in the last few decades. Consequently, a good determination of its dynamic mechanical properties is important for an appropriate design of its industrial application. These studies are usually performed by a three-point bending test using a dynamic mechanical analyzer (DMA). In this work, we show that the three points bending test on a bi-layer system carried out with the test tool provided in a commercial DMA, for example the dynamic mechanical thermal analyzer (DMTA) Rheometric IV, can lead to erroneous results. Measurements on polymer-hard substrate bi-layer systems around the glass transition temperature of the polymer, T-g, give larger changes in elastic modulus and loss tangent than they are. This problem is not observed at temperatures lower than T-g. The design of new test tool and specimen geometry for the three points bending test is shown together with its application to the measurement of the dynamic elastic properties of a polyvinyl chloride (PVC)-aluminum bi-layer system.

• 出版日期2004-4-15