High-Efficiency Micromachined Sub-THz Channels for Low-Cost Interconnect for Planar Integrated Circuits

作者：Yu, Bo^*; Liu, Yuhao^*; Ye, Yu^*; Ren, Junyan^*; Liu, Xiaoguang^*; Gu, Qun Jane^*

来源：IEEE Transactions on Microwave Theory and Techniques, 2016, 64(1): 96-105.

DOI：10.1109/TMTT.2015.2504443

• Channel
• dielectric waveguide
• interconnect
• micromachined
• sub-THz
• terahertz (THz)

This paper presents for the first time the design, fabrication, and demonstration of a micromachined silicon dielectric waveguide based sub-THz interconnect channel for a high-efficiency, low-cost sub-THz interconnect, aiming to solve the long-standing intrachip/interchip interconnect problem. Careful studies of the loss mechanisms in the proposed sub-THz interconnect channel are carried out to optimize the design. Both theoretical and experimental results are provided with good agreement. To guide the channel design, a new figure of merit is also defined. The insertion loss of this first prototype with a 6-mm-long interconnect channel is about 8.4 dB at 209.7 GHz, with a 3-dB bandwidth of 12.6 GHz.

• 出版日期2016-1
• 单位复旦大学