Microstructure and Interfacial Reactions During Active Metal Brazing of Stainless Steel to Titanium

作者：Laik A^*; Shirzadi A A; Tewari R; Kumar Anish; Jayakumar T; Dey G K

来源：Metallurgical and Materials Transactions A-Physical Metallurgy and Materials Science, 2013, 44A(5): 2212-2225.

DOI：10.1007/s11661-012-1599-1

Microstructural evolution and interfacial reactions during active metal vacuum brazing of Ti (grade-2) and stainless steel (SS 304L) using a Ag-based alloy containing Cu, Ti, and Al was investigated. A Ni-depleted solid solution layer and a discontinuous layer of (Ni,Fe)(2)TiAl intermetallic compound formed on the SS surface and adjacent to the SS-braze alloy interface, respectively. Three parallel contiguous layers of intermetallic compounds, CuTi, AgTi, and (Ag,Cu)Ti-2, formed at the Ti-braze alloy interface. The diffusion path for the reaction at this interface was established. Transmission electron microscopy revealed formation of nanocrystals of Ag-Cu alloy of size ranging between 20 and 30 nm in the unreacted braze alloy layer. The interdiffusion zone of beta-Ti(Ag,Cu) solid solution, formed on the Ti side of the joint, showed eutectoid decomposition to lamellar colonies of alpha-Ti and internally twinned (Cu,Ag)Ti-2 intermetallic phase, with an orientation relationship between the two. Bend tests indicated that the failure in the joints occurred by formation and propagation of the crack mostly along the Ti-braze alloy interface, through the (Ag,Cu)Ti-2 phase layer. DOI: 10.

• 出版日期2013-5