摘要

In this paper, we introduce a one-dimensional finite element procedure for modeling shape memory alloy components used in multi-physics based applications including MEMS and biomedical applications. The procedure addressed in this paper is based on a sequential solution of two main finite-element procedures which are then combined after each iteration. The procedure was applied to model an SMA wire and the results were compared with corresponding numerical and experimental results from the literature for different loading cases and boundary conditions. The results showed very good agreement with both experimental and numerical results. The procedure was found to be capable of capturing system characteristics such as structural and thermal non-linearity, variable SMA material properties and the ability to model coupled electrical, thermal and structural loading and boundary conditions and was general enough to be extensible to various geometrical shapes and different SMA constitutive models.

  • 出版日期2010

全文