Application of nano-sized copper powders prepared by gel-casting method in conductive adhesives

作者：Ye, Nan Min; Cheng, Ji Gui; Chen, Wen Chao; Li, Jian Feng

来源：Chinese Journal of Nonferrous Metals, 2015, 25(5): 1264-1269.

• Bisphenol A epoxy resin
• Bonding strength
• Conductive adhesive
• Gel-casting method
• Nano sized
• Particle size and morphologies
• Silane coupling agent
• Silane coupling agent KH550

Nano-sized copper powders were prepared by gel-casting method using copper nitrate and graphite as the main raw materials. Silane coupling agent KH550 was used in the surface antioxidant treatment of copper powders. Using the as-prepared nano-sized copper powders as conductive fillers and the bisphenol A epoxy resins (E51) as matrix, nano-copper filled conductive adhesives were prepared by adding appropriate amount of curing agent, thinner, defrother, promoter and other additive agents. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were used to characterize the phase composition, particle size and morphology of the copper powders. The copper powders before and after anti-oxidation treatment was conducted by TG-DSC analysis. The influence of the nano-sized copper powder content on the resistivity and bonding strength of the adhesives was investigated. The results show that the copper powders prepared by gel-casting method are of high purity, well dispersibility and a mean particle size of about 60 nm. After being treated by silane coupling agent, the oxidation property of the nano-sized copper powders can be obviously improved. The content of nano-sized copper powders has a great effect on the volume resistivity and bonding strength of the conductive adhesives, the optimum sample with volume resistivity of 1.7×10-3Ω·cm and bonding strength of 11.4 MPa can be prepared when the filling amount of nano-sized copper powders is 60% (mass fraction).

• 出版日期2015
• 单位合肥工业大学