Analysis of water adsorption in plasma-damaged porous low-k dielectric by controlled-atmosphere infrared spectroscopy

作者：Darnon Maxime^*; Chevolleau Thierry; Licitra Christophe; Rochat Nevine; Zocco Julien

来源：Journal of Vacuum Science and Technology B, 2013, 31(6): 061206.

DOI：10.1116/1.4827252

The integration of porous dielectric (low-k) in interconnects of integrated circuits is limited by the damage induced by plasma processes to the porous material. Plasma-damaged materials become hydrophilic, which degrades the electrical properties. However, the exact role of water is not fully understood. In this paper, the authors setup a dedicated cell to analyze water adsorption in plasma-damaged porous low-k dielectrics by infrared spectroscopy at various pressures of water vapor. The authors show that OH groups are present in the material under vacuum and that water adsorbs in the material first as icelike water and then as liquidlike water when the relative humidity is larger than similar to 50%. The consequences for microelectronics applications are discussed.

• 出版日期2013-11
• 单位中国地震局