Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5

作者：Mu D; Huang H; Nogita K^*

来源：Materials Letters, 2012, 86: 46-49.

DOI：10.1016/j.matlet.2012.07.018

• Solders
• Nanoindentation
• Electron Backscattering Diffraction (EBSD)
• Intermetallics
• Mechanical properties

The mechanical reliability of solder joints is influenced by a layer of Cu6Sn5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu6Sn5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn-4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu6Sn5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.

• 出版日期2012-11-1