Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers

作者：Kim Sanwi; Kim Taek Soo^*

来源：Microelectronics Reliability, 2014, 54(4): 833-839.

DOI：10.1016/j.microrel.2013.11.008

Adhesion and mechanical reliability improvement is an important issue for flexible electronics due to weak bonds between silicon/underfill/polyimide interfaces. These interfaces are bonded with weak hydrogen and ester bonds which are vulnerable to humidity. Therefore, in this study, adhesion and reliability of silicon/underfill/polyimide interfaces are enhanced by using UV/Ozone treatment and sol-gel derived hybrid layers. In order to examine the effectiveness of those surface treatment methods, double cantilever beam (DCB) test and subcritical crack growth test were applied to accurately measure the adhesion energy and subcritical crack growth rate. The results showed that the adhesion and reliability against humidity were enhanced by more than 300% and 1000% when both surface treatment methods were applied. Also, the adhesive failure path was altered to mixed mode failure of both cohesive and adhesive failure paths.

• 出版日期2014-4