摘要

In this paper, we investigate the charge sharing collection induced by heavy ion radiation in a tripe well CMOS technology with n(+) deep well though 3-D TCAD device simulation. Result shows that n(+) deep well will induce the parasitical NPN bipolar transistor, and therefore enhance the charge sharing between NMOS remarkably. The enhancement factor is 2-4 times that in PNP bipolar in dual well technology. Furthermore, the effects of n-well contact and p-well contact on NPN bipolar are studied. The result shows that the NPN bipolar enhancement factor will decrease with the increase of p-well contact area and with the decreasing of its distance to device, while the NPN bipolar enhancement factor will increase with the increase of n-well contact area.