Advanced experimental back-end-of-line (BEOL) stability test: Measurements and simulations

作者：Vanstreels Kris^*; Cherman Vladimir; Gonzalez Mario; De Wolf Ingrid; Van der Plas Geert; De Vos Joeri; Bommels Jurgen; Tokei Zsolt

来源：Microelectronic Engineering, 2015, 137: 54-58.

DOI：10.1016/j.mee.2014.10.014

• Chip-package interaction
• Bump Assisted BEOL Stability Indentation test
• In-situ stress monitoring

Chip-package interaction (CPI) is becoming a critical issue for the reliability of back-end-of-line (BEOL) during or after package assembly. Complex BEOL layer stacks must have sufficient mechanical strength to survive the thermally induced stresses during processing or working lifetime. Therefore, it is necessary to assess possible failure mechanisms already at early phases of development so that the integrity of the chips can be guaranteed. This paper presents an advanced experimental stability test that combines a BABSI test (Bump Assisted BEOL Stability Indentation test) with in-situ monitoring of the induced stress during this test. A good agreement was found between the applied loads to the BEOL stack, the response of stress sensors below the bump (a Cu pillar) and finite element simulations.

• 出版日期2015-4-2