Activation of Ceramics by Nickel Nanoparticles for Electroless Copper Plating

作者：Ma Hongfang^*; Ding Yanguang; Ren Yuan; Liu Wenfei; Ma Fang; Wang Xiaorui

来源：Rare Metal Materials and Engineering, 2013, 42: 509-512.

• Ni nanoparticles
• activation
• ceramics
• electroless copper plating

Ceramic has not self-catalytic activity to the electroless plating, therefore it needs to be activated before electroless plating. Nickel nanoparticles possess small size effect, large specific surface area, and high surface energy and exhibit high catalytic activity. So they could be adsorbed on the ceramics surface and generate nucleation sites for the copper atoms to deposit on. Nickel nanoparticles were synthesized by the wet chemical reduction method and applied as the activator for electroless copper plating on ceramics. The crystal structure, surface morphology and elemental composition of the coating were analyzed by X-ray diffraction, scanning electron microscope, atomic-force microscope and energy dispersive spectrometer. Compared with the palladium activator, the nickel nanoparticles can simplify the activation process, and improve the deposition rate. A more compact and homogeneous copper coating with good bonding obtained via activation by nickel nanoparticles.

• 出版日期2013-6
• 单位山东建筑大学