科研之友
微信
新浪微博
Facebook
分享链接
摘要
In this study, an antenna design technique that includes wire bond interconnection for 60-GHz antenna-chip integration is investigated. The presented technique is unique as it does not require additional matching elements to deal with wire bond interconnection effects on the antenna input impedance matching bandwidth. As the reactance of the bonding wires is compensated by design of the antenna circuit, the matching bandwidth is not significantly reduced. To the authors' knowledge, this is the first antenna design presented for integration with a 60-GHz CMOS chip using wire bond interconnection without a compensation network.
- 出版日期2011-3-21
