MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer

作者：Schelcher G^*; Brault S; Parrain F; Lefeuvre E; Dufour Gergam E; Tatoulian M; Bouville D; Desgeorges M; Verjus F; Bosseboeuf A

来源：Journal of the Electrochemical Society, 2011, 158(5): H545-H550.

DOI：10.1149/1.3568823

A low cost and low temperature microelectromechanical systems (MEMS) transfer process is presented. The process is based on adhesion control of molded electroplated Ni microstructures on the donor wafer by using a plasma deposited fluorocarbon film. Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing off from the donor wafer. This proposed process has allowed us to realize from 7 mu m down to 700 nm thick Ni patterns on Si, Pyrex glass wafers and Kapton foils. Multiple transfers lead to Ni stacked microstructures. We demonstrated the interest of a simple film transfer process for the elaboration of 3D microstructures.

• 出版日期2011