Anodic Dissolution of Copper in Choline Chloride-Urea Deep Eutectic Solvent

作者：Tang, Jie; Xu, Cunying^*; Zhu, Xiaolin; Liu, Hai; Wang, Xiang; Huang, Mengting; Hua, Yixin; Zhang, Qibo; Li, Yan

来源：Journal of the Electrochemical Society, 2018, 165(9): E406-E411.

DOI：10.1149/2.0091810jes

• ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY
• IONIC LIQUIDS
• ACID-SOLUTION
• CORROSION
• ELECTRODEPOSITION
• ELECTRODISSOLUTION
• ADDITIVES
• MECHANISM
• METALS
• MEDIA

The anodic dissolution behavior of copper in choline chloride-urea deep eutectic solvent (ChCl-urea DES) was investigated using coulometric weight loss experiments, polarization techniques, electrochemical impedance spectroscopy and UV-Vis spectroscopy. It is indicated that the copper was mainly oxidized copper(I) ion, and formed Cu(I) complex, [CuCl2](-) and [CuCl3](2-), in electrolyte. The copper was found to be easier dissolved when the ChCl-urea electrolytes contained 0.01 M CuCl. A higher CuCl concentration led to increase of polarization resistance, and further caused the slight decrease of corrosion current density. The apparent activation energy of the dissolution process was 19.1 kJ . mol(-1) assigning a mass transport limited reaction. The impedance measurements and impedance data fitting to equivalent circuits show that the dissolution of copper in ChCl-urea DES can be described by the duplex salt film model, consisting of compact CuCl and saturated Cu(I) complex film. The formation of duplex salt film can be decreased by increasing the temperature, thereby increasing ligand and Cu(I) transport.

• 出版日期2018
• 单位昆明理工大学