A LOW POWER CRYOGENIC CMOS ROIC DESIGN FOR 512 x 512 IRFPA

作者：Zhao Hongliang^*; Zhao Yiqiang; Song Yiwei; Liao Jun; Geng Junfeng

来源：Journal of Circuits, Systems, and Computers, 2013, 22(10).

DOI：10.1142/S0218126613400331

• Cryogenic electronics
• IRFPA
• low power
• ROIC

A low power readout integrated circuit (ROIC) for 512 x 512 cooled infrared focal plane array (IRFPA) is presented. A capacitive trans-impedance amplifier (CTIA) with high gain cascode amplifier and inherent correlated double sampling (CDS) configuration is employed to achieve a high performance readout interface for the IRFPA with a pixel size of 30 x 30 mu m(2). By optimizing column readout timing and using two operating modes in column amplifiers, the power consumption is significantly reduced. The readout chip is implemented in a standard 0: 35 mu m 2P4M CMOS technology. The measurement results show the proposed ROIC achieves a readout rate of 10MHz with 70mW power consumption under 3.3V supply voltage from 77K to 150K operating temperature. And it occupies a chip area of 18: 4 x 17: 5 mm(2).

• 出版日期2013-12
• 单位天津大学; 辽宁大学