A new TiW seed layer for SmCo5 films with perpendicular magnetic anisotropy

作者：Cheng Weiming; Liu Wenwu; Wang Xiao; Dai Yifan; Cheng Xiaomin; Miao Xiangshui^*

来源：Journal of Magnetism and Magnetic Materials, 2012, 324(22): 3658-3661.

DOI：10.1016/j.jmmm.2012.05.015

• Non-ferrous metal and alloy
• Magnetic
• Microstructure

A new seed layer TiW is proposed for SmCo5 films with perpendicular magnetic anisotropy. The influence of a TiW seed layer on the microstructure and the surface morphology of Cu underlayer are studied. The grain size and surface roughness dependence of Cu underlayer on the thickness and the annealing of the TiW seed layer are also investigated. The improvement in the perpendicular magnetic properties of SmCo5 film from the TiW seed layer is approved. The results show that a 5 nm Ti3W7 seed layer improves the microstructure and surface morphology of Cu underlayer, and significantly improves the perpendicular magnetic properties of SmCo5 film. The diffusion barrier and a high melting point of the TiW seed layer are regarded as the physical mechanism of the improvement for SmCo5 film with perpendicular magnetic anisotropy.

• 出版日期2012-11
• 单位华中科技大学