An accurate RLGC circuit model for dual tapered TSV structure

作者：Zhen, Wei; Xiaochun, Li; Junfa, Mao

来源：Chinese Journal of Semiconductors, 2014, 35(9): 095008.

DOI：10.1088/1674-4926/35/9/095008

• Circuit modeling
• Current continuity
• Eddy effect
• Numerical integration methods
• Tapered TSV

A fast RLGC circuit model with analytical expression is proposed for the dual tapered through-silicon via (TSV) structure in three-dimensional integrated circuits under different slope angles at the wide frequency region. By describing the electrical characteristics of the dual tapered TSV structure, the RLGC parameters are extracted based on the numerical integration method. The RLGC model includes metal resistance, metal inductance, substrate resistance, outer inductance with skin effect and eddy effect taken into account. The proposed analytical model is verified to be nearly as accurate as the Q3D extractor but more efficient.

• 出版日期2014
• 单位上海交通大学