ANALYSIS OF THE EFFECT OF THE STRUCTURE OF A CAPILLARY PUMPED LOOP ON TEMPERATURE OF DUAL CPUs 1U CLOUD SERVERS

作者：Tzou Yeun Ming^*; Lin Wei Keng; Lin Yu An

来源：Heat Transfer Research, 2013, 44(1): 71-99.

• capillary pumped loop (CPL)
• dual core CPUs
• thermal resistance

In this study, we design both the structure and experiments with serial and parallel CPLs for 1U cloud servers with dual core CPUs. We also show that the performance of the parallel CPL is better than that of the existing serial CPL due to the heat load sharing on evaporators and nonincrement on the section area of a condenser. The parallel design in this study contains three loops, CPL-I (asymmetrical type), CPL-II (asymmetrical evaporator heads), and CPL-III (complete symmetrical type). The CPL-I induces the instability due to the startup problem, and results in the restrictions on application. Here, this problem is solved in the CPL-II. Experimental results show that the performance of CPL-III is the best. In addition, carried out with account for the fan configuration, fins on the evaporators, and with the pre-cooling action, the experiments showed good results: the temperatures of the CPU1 and CPU2 were 66.8 degrees C and 63.3 degrees C, respectively, when the heating wattage for both CPUs was up to 150 W each, with the thermal resistance being 0.31 degrees C/W and 0.286 degrees C/W, respectively. The maximum performance of the CPL in this study amounts to 400 W carried away under the limitation of the CPU temperature below 80 degrees C.

• 出版日期2013
• 单位清华大学