摘要

In order to clarify the friction and wear mechanism in their transition region at an atomic level, various molecular dynamics simulations have been performed. The specimen and the slider are assumed to consist of monocrystalline copper and rigid diamond, respectively, and Morse potential is postulated between a pair of atoms. The atomic behaviors in a plane corresponding to the (111) plane of copper are simulated dealing with a plane strain problem. In the simulations, the influence of the indentation depth on friction and wear phenomena was investigated. As a result, friction and wear process of copper by the hard particle were classified into four region as follows: (1) Friction process by atomic-scale stick-slip phenomenon, (2) Friction process with elastic deformation, (3) Wear process with ploughing due to removal of atoms, (4) Wear process with ploughing due to plastic deformation, and each features were clarified.

  • 出版日期2003