Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening

作者：Huang JY^*; Zhu YT; Jiang H; Lowe TC

来源：Acta Materialia, 2001, 49(9): 1497-1505.

DOI：10.1016/S1359-6454(01)00069-6

• repetitive corrugation straightening
• microstructure
• transmission electron microscopy (TEM)
• copper

The microstructures and dislocation configurations in nanostructured Cu processed by a new technique, repetitive corrugation and straightening (RCS), were studied using transmission electron microcopy (TEM) and high resolution TEM. Most dislocations belong to 60 degrees type and tend to pile up along the {111} slip planes. Microstructural features including low-angle grain boundaries (GBs), high-angle GBs, and equilibrium and non-equilibrium GBs and subgrain boundaries were observed. Dislocation structures at an intermediate deformation strain were studied to investigate the microstructural evolutions, which revealed some unique microstructural features such as isolated dislocation cell (LDC), dislocation tangle zones (DTZs), and uncondensed dislocation walls (UDWs).

• 出版日期2001-5-25