摘要

While graphene and few layer graphene (FLG) are considered as having the highest thermal conductivity in their in-plane directions, our molecular dynamics (MD) simulations however show that those systems are also characterized by a superior thermal contact resistance, which could be largely tuned with the layer number when in contact with a silica substrate. Taking advantages of such a resistive interface, MD simulations show that SiO2/FLG superlattices have a thermal conductivity as low as 0.30 W/m K, exhibiting a promising prospect in nano-scale thermal insulation. These findings pave the way for an improved thermal management of nanoscale systems such as thermal barrier coatings and phase change memory materials with atomic-scale super-insulators.

  • 出版日期2013