Micro thermoelectric cooler: Planar multistage

作者：Hwang G S; Gross A J; Kim H; Lee S W; Ghafouri N; Huang B L; Lawrence C; Uhef C; Najafi K; Kaviany M^*

来源：International Journal of Heat and Mass Transfer, 2009, 52(7-8): 1843-1852.

DOI：10.1016/j.ijheatmasstransfer.2008.10.014

• Micro thermoelectric (TE) cooler
• Planar multistage
• Optimal design
• Bi(2)Te(3)
• Sb(2)Te(3)
• Substrate conduction
• Radiation
• Thermal isolation
• Thermal network model

A suspended, planar multistage micro thermoelectric (TE) cooler is designed using thermal network model to cool MEMS devices. Though the planar (two-dimensional) design is compatible with MEMS fabrication, its cooling performance is reduced compared to that of a pyramid (three-dimensional) design, due to a mechanically indispensable thin dielectric substrate (SiO(2)) and technical limit on TE film thickness. We optimize the planar, six-stage TE cooler for maximum cooling, and predict Delta T(max) = 51 K with power consumption of 68 mW using undoped, patterned 4-10 mu m thick co-evaporated Bi(2)Te(3) and Sb(2)Te(3) films. Improvement steps of the planar design for achieving cooling performance of the ideal pyramid design are discussed. The predicted performance of a fabricated prototype is compared with experimental results with good agreements.

• 出版日期2009-3