A Fully SiP Integrated V-Band Butler Matrix End-Fire Beam-Switching Transmitter Using Flip-Chip Assembled CMOS Chips on LTCC

作者:Kuo Che Chung*; Lu Hsin Chia; Lin Po An; Tai Chen Fang; Hsin Yue Ming; Wang Huei
来源:IEEE Transactions on Microwave Theory and Techniques, 2012, 60(5): 1424-1436.
DOI:10.1109/TMTT.2012.2187795

摘要

In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.