Microstructure characterization of Cu processed by compression with oscillatory torsion

作者：Rodak K^*; Pawlicki J

来源：Materials Characterization, 2014, 94: 37-45.

DOI：10.1016/j.matchar.2014.05.002

• Copper
• Compression with oscillatory torsion
• Grain refinement
• Microstructure
• EBSD
• STEM

High purity Cu (99.9%) was subjected to severe plastic deformation up to a total effective strain epsilon(ft) = 130 through compression with the oscillatory torsion method at room temperature. This method produces an ultrafine grain microstructure. The microstructure evolution was investigated with respect to the value of the total effective strain using a scanning electron microscope with an electron-backscattered diffraction technique and a scanning transmission electron microscope. The results of the structural analyses show that increasing epsilon(ft) from 2 to 50 causes progress in the grain refinement. A quantitative study of the microstructure parameters, such as fraction of high angle boundaries, grain and subgrain diameter, and the area fraction of grains up to 1 mu m, shows that deformation at epsilon(ft) = 45 guaranteed the best conditions for refining the microstructure of Cu. Using high values of epsilon(ft) in the range 60 to 130 restricts grain refinement because intensive recovery begins to dominate in the microstructure.

• 出版日期2014-8