科研之友
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摘要
A roll-to-roll forming process is one of important metal processing technologies, because the process is simple and economical. These days, a roll-to-roll forming process is tried to be employed in the manufacturing of the circuit board, barrier ribs and other electronic device. In this study, the roll-to-roll forming process for the micro scale pattern in electronic device panel is designed and analyzed. Because the electronic devices such as flexible display have millions of cavities, the analysis of forming process considering all the cavities is impossible due to the high computational costs and memory limit. Therefore, the optimum analysis conditions that guarantee the analysis results and computational efficiency are found. Also, the analysis is carried out for indentation process instead of the roll-to-roll forming process for the computational effectiveness and the reliability is verified. The macro scale experiments are carried out to validate the analysis results. Then, the pattern shapes are designed in viewpoint of formability. The effect of punch shapes such as pitch and draft angle on crack initiation are investigated. Crack initiation is evaluated by Cockcroft-Latham damage values. The effect of temperature on formability is also investigated. From the analysis for various punch shape at various temperature, the successful forming conditions are found.
- 出版日期2010-9
