Improvement of thermal properties and flame retardancy of epoxy-amine thermosets by introducing bisphenol containing azomethine moiety

作者：Zhang, X H^*; Huang, L H; Chen, S; Qi, G R

来源：Express Polymer Letters, 2007, 1(5): 326-332.

DOI：10.3144/expresspolymlett.2007.46

• thermosetting resins
• thermal stability
• flame retardancy
• epoxy
• bisphenol

A novel bisphenol 1, 4'-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine. The curing behavior of DGEBA/diamine changed dramatically due to the introduction of BHPB. The resultant epoxy thermosets containing BHPB had high T(g)s (127-160 degrees C), high T(d,5%) (>= 330 degrees C) and high integral procedure decomposition temperature (IPDT) values (662-1230 degrees C) and good flame retardancy because of their high Limiting Oxygen Index (LOI) values (above 29.5).

• 出版日期2007-5
• 单位浙江大学; 吉首大学