摘要

Under rapid solidification conditions, a eutectic microstructure becomes unstable beyond a certain velocity that places a limit on the finest spacing and the largest interface undercooling that can be achieved for such a microstructure. Expressions are developed to characterize the physics that lead to the limit of eutectic growth. Activation energy for diffusion and eutectic temperature are shown to play key roles at the limit of eutectic growth, and this limit modifies the high-velocity branch of the coupled growth regime.