A novel packaging stress isolation structure for SOI based MEMS gyroscopes

作者：Hao Yongcun; Yuan Weizheng; Xie Jianbing; Chang Honglong

来源：15th IEEE Sensors Conference, SENSORS 2016, 2016-10-30 To 2016-11-02.

DOI：10.1109/ICSENS.2016.7808649

• Circular disk
• Isolation structures
• MEMS gyroscope
• Micro electromechanical system (MEMS)
• Orders of magnitude
• Packaging stress
• Silicon-on
• insulators (SOI)
• Support frames

In this paper, we propose a packaging stress isolation structure for the silicon-on-insulator (SOI) based microelectromechanical systems (MEMS) gyroscopes. The structure is designed on the handle layer and consists of a circular disk, eight 'L-shape'elastic beams, and a support frame. The disk is located on the center of the die and occupies less than 5 percent of the whole handle layer area which can reduce the packaging stress and avoid the uneven stress distribution. The elastic beams are orthogonally distributed along the x and y axis connecting the disk with the support frame, which can further suppress stress evenly. The results reveal that the packaging stress transferred to the gyroscope is reduced by two orders of magnitude.

• 出版日期2016
• 单位西北工业大学