Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

作者:Wang Yi Qi; Ko Byung Han; Jeong Sang Geuk; Park Kyoung Su; Park No Cheol*; Park Young Pil
来源:Microsystem Technologies, 2015, 21(12): 2565-2571.
DOI:10.1007/s00542-015-2493-8

摘要

Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.

  • 出版日期2015-12