New bonded assembly configuration for dynamic mechanical analysis of adhesives

作者：Causse N; Quiroga Cortes L; Dantras E^*; Tonon C; Chevalier M; Combes H; Guigue P; Lacabanne C

来源：International Journal of Adhesion and Adhesives, 2013, 46: 1-6.

DOI：10.1016/j.ijadhadh.2013.05.011

• Dynamic mechanical analysis
• Adhesively bonded joint
• Bulk adhesive
• Epoxy
• Molecular mobility

A new sample configuration has been developed in order to study molecular mobility of an adhesive in a bonded assembly configuration by dynamic mechanical analysis. The torsional rectangular mode is used to provide a shear solicitation all along the adherend/adhesive interface. The initial mechanical properties of each assembly%26apos;s constituent are first investigated as reference. The modulus of aluminum foils used as substrates exhibits a classic elastic component and a slight viscous part due to microstructural changes or stress relaxation. Four relaxation modes are highlighted and identified for epoxy adhesive tested as a bulk material. Its viscoelastic behavior is compared to the one of adhesive tested in assembly configuration. The relaxation modes of the adhesive remain visible in spite of the sample stiffening by aluminum foils. Relaxation modes comparison shows that the temperature of loss modulus associated with the mechanical manifestation of glass transition slightly increases for the assembly configuration. Energy losses during this relaxation are much higher in the assembly configuration. Influence of rigid aluminum substrates is discussed in terms of the adhesively bonded joint solicitation mode.

• 出版日期2013-10