科研之友
微信
新浪微博
Facebook
分享链接
摘要
Phase-change thermal control is a promising method that uses phase change of phase change materials (PCM) to control subject temperature. Expanded graphite/paraffin composite PCM with excellent thermal conductivity and heat storage capacity was applied to prepare a heat storage unit, which was integrated into an electronic cooling experimental system. The surface temperature variation of simulative chips as a function of time was investigated under three workloads. The results were compared with traditional cooling systems to investigate the effect of phase-change thermal control on transient thermal management of electronic components. The experimental results show that the heat shock resistance of the new cooling system is 1.4 times better than the traditional cooling system under same experimental conditions. The composite PCM in transient thermal management can effectively reduce surface temperature and temperature fluctuation of electronic components, which ensures operational reliability and stability.
