Approach on Thermal Strain Behaviour of PBGA Solder Joints

作者：Yang Ping^*; Shen Cai Jun; Liao Ningbo

来源：Strain, 2009, 45(6): 527-534.

DOI：10.1111/j.1475-1305.2008.00523.x

• experimental test
• finite element
• PBGA
• solder ball
• temperature cycle
• thermal strain

The aim of this study was to provide a systematic method to analyse and test the thermal strain behaviour of plastic ball grid array (PBGA) solder joints in electronic packaging. Based on the structural, thermal and physical properties of the PBGA sample, the thermal strain test was developed to measure the strain distribution at the surface of the bismaleimide triazin (BT) substrates and the printed circuit board (PCB) surface under thermal cycling, at the temperature range of 0 to 100 degrees C. The experimental results show that the changing trends of strain in the BT and PCB surfaces were approximately the same during the thermal cycling. Comparison between the experimental results and simulation illustrates the validity of the experimental test and finite element modelling results. It builds a basis for future work for evaluating the design and reliability of the BGA packaging.

• 出版日期2009-12
• 单位江苏大学