Atomic diffusion properties in wire bonding

作者：Li, JH^*; Wang, FL; Han, L; Duan, JA; Zhong, J

来源：Transactions of Nonferrous Metals Society of China, 2006, 16(2): 463-466.

DOI：10.1016/S1003-6326(06)60079-4

• thermosonic bond
• atomic diffusion
• dimples
• bonding strength

The lift-off characteristics at the interface of thermosonic bond were observed by using scanning electron microscope (JSM-6360LV). The vertical section of bonding point was produced by punching, grinding and ion-sputter thinning, and was tested by using transmission electron microscope (1730). The results show that the atomic diffusion at the bonded interface appears. The thickness of Au/Al interface characterized by atomic diffusion is about 500 nm under ultrasonic and thermal energy. The fracture morphology of lift-off interface is dimples. The tensile fracture appears by pull-test not in bonded interface but in basis material, and the bonded strength at interface is enhanced by diffused atom from the other side.

• 出版日期2006-4
• 单位中南大学