科研之友
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摘要
Based on the model of a grain cutting trace in workpiece during two-dimensional ultrasonic assisted grinding, microscopic cutting trace of the grain is analyzed, and the grain cutting trace of spiral line is defined, the motion model of the contact between single abrasive particle and workpiece in a vibration period is established during two-dimensional ultrasonic assisted grinding, and the results show that the grain motion mode of two-dimensional ultrasonic assisted grinding is similar to the rotary cutting mode. Grinding experiments on surface quality of nano-ZrO2 ceramic are carried out using diamond grinding in different condition, both with and without ultrasonic vibration. Experimental results show that the surface quality after two-dimensional ultrasonic assisted grinding is superior to that after diamond grinding, and it is easier for two-dimensional ultrasonic assisted grinding as material removal mechanism employs ductile grinding mode.
