科研之友
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摘要
Contact adhesive force (F-a) scaling is critical for relay miniaturization, since the actuation area and/or actuation voltage must be sufficiently large to overcome the spring restoring force (F-k) in order to turn on the relay and F-k must be larger than F-a in order to turn off the relay. In this work, contact adhesive force is investigated in MEM logic relays with contact dimple regions as small as 100 nm in lateral dimension. The results indicate that van der Waals force is predominant. An adhesive force of 0.02 nN/nm(2) is extracted for tungsten-to-tungsten contact. F-a reduction should be possible with contact dimple size reduction and contact surface coating.
- 出版日期2014-2
- 单位rutgers
