Microstructure and mechanical properties of diffusion bonded SiC/steel joint using W/Ni interlayer

作者：Zhong, Zhihong; Hinoki, Tatsuya^*; Jung, Hun Chea; Park, Yi Hyun; Kohyama, Akira

来源：Materials and Design, 2010, 31(3): 1070-1076.

DOI：10.1016/j.matdes.2009.09.049

• Diffusion bonding
• Non-ferrous metals and alloys
• Silicon carbide

This paper describes the design and examination of W/Ni double interlayer to produce a joint between SiC and ferritic stainless steel. Diffusion bonding was performed by a two steps solid state diffusion bonding process. Microstructural examination and mechanical properties evaluation of the joints show that bonding of SiC to steel was successful. EDS and XRD analysis revealed that W5Si3 and WC were formed at SiC/W interface. The diffusion products at W/Ni interface. Ni-rich solid solution Ni(W) or intermetallic compound Ni4W, was found to be dependent on the second step joining temperature. Neither intermediate phases nor reaction products was observed at Ni/steel interface for the joints bonded at the temperature studied. The average tensile strength of 55 MPa which is insensitive to the second step process was measured for as-bonded SiC/steel joint and the failure occurred at SiC/W interface. The hardness near the various bonded interfaces was also evaluated.

• 出版日期2010-3